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POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

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POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000pc/Month

Delivery Time : 4 Weeks

Packaging Details : PCB + Box

Brand Name : CUSTOM MADE

Certification : ISO/UL

Keyword : Prototype PCB Assembly

Applications : Industrial Control, Medical care, Automotive Electronics, Communications, Interne

PCB Board : POP boards, Normal Boards, FPC boards, Rigid-flex boards, Metal base boards

Special Capability : Gold Finger Plating,Peelable,Carbon ink

SMT Lines : 12 SMT lines

Surface Finished : HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp,Immersion Gold+OSP

Materials : FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872

Min PP Thickness : 0.06mm

Payment Method : T/T

Whether to Support customization : Support

Logistics : Accept customer specified logistics

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Prototype PCB Assembly Supports Rigid 12 SMT Lines 0.3 - 6.5mm Thickness

Prototype PCB Assembly Description:

1. Quick-turn prototype PCB assembly.
2. SMT/SMD assembly.
3. Thru-hole assembly.
4. Mixed Technology (SMT/Thru-hole).
5. Turn-key assembly.
6. Consignment assembly.
7. RoHS-compliant lead-free assembly / Non-RoHS assembly.


Prototype PCB Assembly Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.5-17.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink


Prototype PCB Assembly Introduction:

The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.

POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design


Product Tags:

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POP Multilayer Rf Pcb Design

      
China POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design factory

POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design Images

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